We are redirecting you to the source. If you are not redirected in 3 seconds, please click here.

Packaging Engineer- Materials at Volantis Semiconductor, Inc.. . Location: Hybrid Remote/SF Bay Area/Austin/Boston. We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing.. .  . . Summary:. . Seeking an experienced engineer to lead wafer level mold and underfill process development for advanced semiconductor packages (fan-out wafer level packaging, 2.5D/3D, chiplet). This role spans. . mold compound and underfill material selection and qualification, wafer level molding and encapsulation processes, underfill dispense and cure, reliability, failure analysis, and cross-functional support through package and system productization.. .  . . Core Responsibilities:. . . Develop and optimize wafer level molding processes including compression molding, transfer. . . molding, and mold underfill (MUF) for fan-out and advanced heterogeneous packages.. . . Own mold compound and underfill material selection and qualification, including evaluation of. . . filler content, CTE, modulus, Tg, viscosity, and moisture uptake to meet thermo-mechanical and. . reliability requirements.. . . Drive underfill process development including capillary underfill (CUF) dispense strategies, flow. . . and void optimization, and cure profile development for high-density flip chip and chiplet. . assemblies.. . . Evaluate and mitigate assembly risks including warpage, delamination, void formation, bleed-out,. . . mold flash, and filler settling; define process windows and controls to ensure repeatable yield. . across wafer and panel formats.. . . Collaborate with OSATs and material suppliers to qualify mold and underfill materials, define. . . dispense and cure equipment requirements, and manage process transfers into production.. . . Lead characterization of mold and underfill material properties (viscosity, gel time, cure kinetics,. . . adhesion, CTE, modulus) and correlate material behavior to process outcomes and package. . reliability.. . . Work closely with thermal mechanical modeling teams to model solder joint reliability of bump. . . interconnects with various underfills and predict warpage with various mold compouds.. . . Support reliability qualification including thermal cycling, drop, mechanical shock, and power. . . cycling.. . . Work cross-functionally with design, reliability, thermal, and manufacturing teams to ensure. . . robust package performance from concept through high-volume production.. .  . .  . . Required Technical Skills:. . . Strong experience in wafer level molding and underfill processes for advanced semiconductor. . . packages including fan-out wafer level packaging (FOWLP), 2.5D, and chiplet architectures.. . . Deep understanding of mold compound and underfill material science including epoxy resin. . . systems, filler particle size and loading, cure chemistry, and how material properties drive. . thermo-mechanical package behavior.. . . Experience with underfill dispense techniques (capillary, no-flow, mold underfill), flow and void. . . characterization, bleed-out control, and cure process optimization including staged and snap. . cure profiles.. . . Understanding of thermo-mechanical behavior driven by mold and underfill materials including. . . CTE mismatch, warpage evolution through cure and reflow, delamination driving forces, and. . material-induced reliability risks.. . . Hands-on experience with failure analysis of mold and underfill failures including cross-sections,. . . SEM/EDS, CSAM, TGA, DSC, and DMA for material characterization and thermal cycling reliability. . evaluation.. . . Ability to work with OSATs and material suppliers to develop, qualify, and transfer mold and. . . underfill processes into production, including equipment setup and process control plans.. . . Strong problem-solving skills with ability to debug mold and underfill yield and reliability issues in. . . manufacturing environments, including DOE-driven process optimization.. .  . .  . . Preferred / Differentiating Skills:. . . Experience underfill materials for III-V or photonics packaging including optically clear. . . encapsulants and low-modulus underfills.. . . Experience with mold and underfill integration in advanced packaging architectures including. . . 2.5D interposers, 3D stacking, chiplet assemblies, and CoWoS-like structures where material. . interactions and warpage are critical constraints.. . . Familiarity with a broad bill of materials for advanced packaging encapsulation including clear. . . adhesives and underfills for photonics, high-filler, low-CTE mold compounds for 2.5D interposer. . assemblies.. . . Experience developing mold and underfill solutions for high-power or high-TDP devices where. . . material thermal conductivity, warpage stability, and coefficient of thermal expansion are tightly. . constrained.. . . Exposure to thermo-mechanical modeling or collaboration with simulation teams for warpage. . . prediction, delamination risk assessment, and material property sensitivity analysis for mold and. . underfill optimization.. . . Understanding of system-level interactions (TIM application and cold plate interaction with wafer. . . level molded wafer).